Polymer-bonded magnets represent an advanced category of magnetic materials that offer distinct advantages over conventional magnetic materials, such as ease of plastic processing, strong corrosion resistance, and the ability to form complex shapes. As a result, polymer-bonded magnets can, to a certain extent, serve as alternatives to traditional magnetic materials.

The ease of plastic processing enables polymer-bonded magnets to be shaped into complex geometries using various methods, including injection molding, extrusion, and hot pressing. This versatility broadens their applicability in manufacturing, allowing the production of magnetic components with intricate designs.

Additionally, polymer-bonded magnets exhibit strong corrosion resistance, ensuring stable performance even in harsh environments. In contrast, conventional magnetic materials are often susceptible to oxidation and corrosion, which can degrade magnetic properties and shorten service life. This makes polymer-bonded magnets particularly suitable for applications where corrosion resistance is critical.

Polymer-bonded magnetic rings, such as those produced by Buji, also demonstrate excellent magnetic performance, achieving high magnetic flux density and permeability even under low magnetic field conditions. These characteristics make them well-suited for use in sensors, electromagnetic actuators, and other applications where they can effectively replace traditional magnetic materials. Furthermore, the customizable nature of polymer-bonded magnets allows for tailored engineering to meet specific performance requirements.

As an innovative magnetic material, injection-molded magnets can partially substitute conventional magnetic materials in various fields. Their advantages in processability, corrosion resistance, and magnetic performance have led to growing adoption across industries. With ongoing advancements in research and production technologies, polymer-bonded magnets are expected to see even broader application and development in the future.